DESCRIPTION
Kingston's KHX1866C9D3T1BK2/8GX is a kit of two
512M x 64-bit (4GB) DDR3-1866 CL9 SDRAM (Synchronous
DRAM) 2Rx8 memory modules, based on sixteen 256M x 8-bit
DDR3 FBGA components per module. Each module kit supports
Intel
is 8GB. Each module kit has been tested to run at DDR3-1866
at a low latency timing of 9-11-9 at 1.65V. The SPDs are
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers.
The JEDEC standard electrical and mechanical specifications
are as follows:
Document No. 4806159-001.A00 08/30/11 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 1.410 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0
Storage Temperature -55
*Power will vary depending on the SDRAM used.
FEATURES
•
starting address "000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
pin (RZQ : 240 ohm ± 1%)
3.9us at 85°C < TCASE < 95°C
double sided component
Memory Module Specifi cations
KHX1866C9D3T1BK2/8GX
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1866MHz CL9 240-Pin DIMM Kit
XMP TIMING PARAMETERS